- Why Thermal Shock Test Chamber Can Be Used In Various Industries
Thermal Shock Test Chamber can accurately simulate the low temperature, high temperature, high temperature and humidity, low temperature and low humidity and other complex natural environment, suitable for plastic, electronics, paper, electrical appliances, food vehicles, metals, chemicals, building materials and other product reliability Detection.
Characteristics of thermal shock test chamber:
The equipment is divided into three parts: high-temperature box, low-temperature box and test box. It adopts the unique heat-sealing structure and heat storage and storage effect. When the test is completely static, the cold and hot temperature is introduced into the test area by hot and cold air way switching Hot and cold impact test purposes.
Outlet and return air outlet sensor detection control, throttle mechanism switching time is completed within 10 seconds, hot and cold impact temperature recovery time is 5 minutes to complete.
With 96 test specifications set independently, the impact time of 999 hours 59 minutes, the cycle of 1 to 999 times can be set to achieve automatic operation of the refrigerator, the maximum degree of automation to reduce the workload of the operator can be automatically at any time Start and stop working.
Running status display and curve display, the abnormal situation, the screen automatically automatically shows the fault point and the reasons and provide troubleshooting methods, and found that the input power is unstable, with an emergency stop device.
The refrigeration system adopts the complex high-efficiency cryogenic circuit system design. The refrigeration unit adopts the imported compressor in Europe and America, and adopts the green environmental protection (HFC) refrigerant R507 and R23 with zero ozone coefficient.
Thermal Shock Test Chamber for the electrical and electronic parts, automation components, communications components, auto parts, metal, chemical materials, plastics and other industries, defense industry, arsenal, aerospace, BGA, PCB substrate, electronic chip IC, The physical changes of polymer materials, test their materials on the high and low temperature resistance and product thermal expansion and contraction of the chemical or physical damage, to confirm the quality of the product. From precision IC to heavy machinery parts, and all need it for testing.
Contact Lisa Zhong
Huilong Village, Qiu'ai Town, Yinzhou District, Ningbo City, China